FAGAL applies the Flight Anatomy philosophy to galvanics. PCB via metallization is not just "dip the board in the bath". It's a physical process where every parameter matters.
Bath temperature. Current density. Ion concentration. Board motion speed. Dwell time. Most control systems use averaged settings and compensate deviations by hand.
FAGAL models the process. Every bath has its parameters. Every board has its via geometry. Every cycle has its history. The system computes; it doesn't guess.
A galvanic line is not avionics. But the principles are the same.
Instead of IMU sensors — temperature, pH, bath conductivity. Instead of frame geometry — board geometry and via layout. Instead of flight dynamics — electrochemistry kinetics.
Typical systems use timers and fixed regimes. "Hold 15 minutes at 2 A/dm²". It works. But it doesn't account for bath fatigue over a day, a 2° temperature shift, or non-standard board thickness.
FAGAL models the process in real time. Measures parameters. Computes reaction rate. Adjusts regime. Not by "recipes". By physico-chemical equations.
Temperature:
Not just "maintain 22°C". Thermal field modelling in the bath. Electrode drift compensation. Bath viscosity change prediction.
Current:
Not fixed density. Adaptive profile with metallization area, via depth, bath concentration. Current distribution over the surface.
Chemistry:
Copper ion concentration, acidity, additives. Not lab samples once a day. Via conductivity and real-time process modelling.
Motion:
Board speed between baths. Dwell in each zone. Sync with other line stations. Cycle optimization by critical path modelling, not "how we always did it".
Technical documentation, test results and development timeline will appear on this page as the project progresses. Watch for updates.